The 4th IEEE International Power Electronics and Application Conference

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Industry Session, Tutorial Submission Deadline Extended to July 30th, 2026
2026/7/16 10:24:26
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2026/7/1 9:51:49
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Masayoshi Tarutani

Masayoshi Tarutani
Mitsubishi Electric Corporation, Japan
Chief Expert
Title: Latest Power Chip & Module Technologies for Diverse Applications from Home Appliances to Energy Infrastructure

Abstract:

In recent years, the rapidly developing AI data centers have increased the importance of cutting-edge power electronics. In particular, applications seeking power devices with high efficiency, stable long-term characteristics, and reliable performance are increasing. Mitsubishi Electric manufactures a wide range of power devices for these needs, from 600V~6500V, from low to high current. This keynote will explain the latest technologies related to Si and especially SiC devices, along with their performance and reliability, and introduce the latest power module products and technologies that contribute to the energy society by supporting a wide range of applications from home appliances to energy infrastructure.

Biography:

In 1996, after earning the Ph.D from Osaka University, he joined Mitsubishi Electric's Advanced Technology R&D Center. He was involved in the development of fundamental process technologies for many devices, including DRAM and SiC. In 2011, with the launch of the SiC wafer process line, he moved to a power device works. After serving as General Manager of two device-related departments, he now supports the development of power device and module technologies as a Chief Expert.

KEYNOTE