Notifications of Student Travel Fund have been sent!
The IEEE PEAC 2018 Advance Program is now available online!
Notifications of paper acceptance have been sent!
Digest Submission Deadline Extended to June 15th, 2018
Call for Papers for IEEE PEAC'2018 Released!
|Prof. Alan Mantooth
University of Arkansas
President of IEEE Power Electronics Society
Title: Design Automation in Power Electronics
Abstract: Design automation for power electronics is a growing need with greater utilization of wide bandgap (WBG) power semiconductor device technologies in applications. Several industry, academic, and design automation companies convened just before ECCE in Portland, Oregon in September to discuss the design issues and whether current tools have need of revision to address the emerging WBG era. This talk will describe the key findings from that workshop. Gaps and research needs will be described including those in multi-objective optimization, multi-disciplinary co-design, and others. Current solutions will be reviewed with a commentary as to where they require growth and expansion.
Biography: Alan Mantooth is a Distinguished Professor of Electrical Engineering at the University of Arkansas and holder of the 21st Century Research Leadership Chair. Dr. Mantooth has 20 years of academic experience in addition to 8 years in industry. He has served in several leadership positions in both industry and academe, and currently serves as Executive Director for the NSF Research Center on GRid-connected Advanced Power Electronic Systems (GRAPES) and as Deputy Director for the NSF Engineering Research Center for Power Optimization of Electro-Thermal Systems (POETS). Since its inception in 2005 he has served as the Executive Director of the National Center for Reliable Electric Power Transmission (NCREPT) and overseen its research and building program, which includes a 6 MVA/15 kV test facility. Dr. Mantooth has published over 300 refereed articles and three books on modeling, design automation, power and analog circuit design and electronic packaging. He is an IEEE Fellow, has served on the IEEE PELS Advisory Committee since 2004 and was elected PELS President for 2017 and 2018.